Luowei HS3 Uniform Preheat Platform for Motherboard Chip BGA Repair

Description

• Uniform heating, no hot air gun required, no soldering iron required

• Aerospace aluminum alloy plate, efficient heating coverage, reduces energy consumption, broad application range

• Compact and portable, compact size, powerful performance precise temperature control

• Maximum power 99W, PD power delivery, more rapid heating

• Light interactivity, simple operation, and color changes reflect the device’s status

• preheat platform, tinning, degumming, laminating, temperature control, vibrant light interaction, safe and constant temperature

• Infinite control knob, simple operation, one-touch adjustment

• The heating area eliminates excess and enhances efficiency and precise heating, 65mm×100mm fits various sizes of smartphone motherboards