JCID Multiple-Sizes Low-Residue Original Desoldering Wire

Description

Features:
Cleans instantly, restoring smooth solder pads
Selected pure copper for faster solder absorption and heat conduction
High-density braiding for faster and stronger solder absorption
Flexible and tensile-resistant, durable and not easily broken
Upgraded toughness; repeated bending and pulling are less likely to break or detach, reducing broken wire residue
Anti-oxidation, leaving no residue
Lightweight and portable, multiple specifications available
Ultra-thin roll design, lightweight and space-saving, available in various lengths to meet different repair needs