2UUL 200°C PPD JOINT X Solder PPD Paste For Mobile Phone Repair

Description

2UUL 200°C PPD JOINT X Solder PPD Paste For Mobile Phone Repair

FS200 (High Temp – 200°C): Formulated for high-temperature sensitive components like CPUs that require higher thermal stability and durable joints.

High Wettability: Ensures smooth solder flow, resulting in clean, shiny, and reliable electrical connections.

Consistent Texture: The smooth paste is optimized for precision application through stencils or syringes without splashing or clumping during heating.

Low Residue Formulation: A “no-clean” formula that leaves minimal waste after soldering, significantly reducing post-repair cleanup time.

Oxidation Resistance: Contains high-quality flux that prevents oxidation, ensuring the longevity and conductivity of the solder joints.