English
Arabic
Description
MIJING MS1-G 16 MOLD
Equipped with intelligent temperature control, the MS1 provides consistent, evenly distributed heat, protecting sensitive motherboard components.
Reduces the risk of motherboard bending or micro soldering damage, ensuring safer chip removal and rework.
Manufactured using high-grade, heat-resistant materials for long-lasting durability.
Designed specifically for iPhone 16 series, ensuring secure placement and optimal heat transfer.
Reduces repair time, increasing productivity for repair technicians.
