Relife RL-093a 0.1mm Heat Sink Copper Sheet

Description

• RL-093 A Chip heat sink copper sheet, rapid cooling efficient heat dissipation, 0.1 mm multiple specifications available

• Efficient and uniform heat diffusion, with high thermal conductivity, it can quickly and evenly transfer heat from the chip to the heat sink, improving the overall heat dissipation effect

• Strong corrosion resistance, with high corrosion resistance, it is not easy to oxidize or corrode, extending the service life of the heat sink

• Multiple specifications available, 0.1 mm available

• Uniform heat diffusion, during maintenance, can dissipate heat to nearby ICs to prevent solder from melting

• Pure copper material, smooth surface without sharp edges or burrs

• Efficient heat dissipation, high thermal conductivity, high heat dissipation efficiency